Electronics

Designing next-generation communication networks: A review of niobium-containing ceramics for 5G devices

By Lisa McDonald / July 26, 2024

In a recent open-access paper, ACerS members Reginaldo Muccillo and Eliana N. S. Muccillo reviewed the key properties of niobium-containing ceramics to demonstrate their potential for application in 5G communication devices.

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Quantum system advancements, plus more inside June/July 2024 ACerS Bulletin

By Lisa McDonald / June 6, 2024

The June/July 2024 issue of the ACerS Bulletin—featuring a look at novel materials and architectures for digital technologies—is now available online. Plus—“Emerging Professionals” section and C&GM.

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Video: Tackling e-waste—Circular Supply Chain Coalition establishes recycling networks in local communities

By Lisa McDonald / June 5, 2024

Even as record amounts of electronic waste are generated, very little of this waste is recycled. The new Circular Supply Chain Coalition aims to establish e-waste recycling networks in local communities.

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Semiconductor advancements: Elastic strain ‘map’ guides the fine-tuning of material properties

By Lisa McDonald / April 9, 2024

Elastic strain engineering has potential to improve processing performance in the semiconductor industry. Researchers led by Nanyang Technological University in Singapore and Massachusetts Institute of Technology used machine learning to create a map that shows how to tune the thermal and electronic properties of crystalline materials via strain engineering.

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Low-temperature synthesis of mesoporous metal oxides unlocks flexible electronic integration

By Guest Contributor / March 8, 2024

In a recent paper, researchers from various universities in the Republic of Korea developed a low-temperature process for synthesizing mesoporous metal oxides, which unlocks the possibility of integrating these materials onto flexible electronics.

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EMA 2024 debuts in Denver

By Amanda Engen / February 28, 2024

The Electronic Materials and Applications Conference moved from its original home in Florida to Denver, Colo., taking place Feb. 13–16, 2024. More than 330 attendees, of which nearly a third were students, attended the conference.

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Rinse and repeat: Water replaces toxic chemicals in printed electronics processing

By Lisa McDonald / February 9, 2024

Printable electronic inks and their associated print processes tend to rely on environmentally hazardous chemicals, which offsets the benefits of printed electronics in application. Engineers at Duke University developed a water-only printing process for fabricating printed electronics.

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Introduction to “Piezoelectric and dielectric ceramics” for ACT @ 20

By Jonathon Foreman / December 15, 2023

To celebrate the milestone of the 20th volume of the International Journal of Applied Ceramic Technology, the editorial team assembled a selection of journal papers representing the excellent work from the advanced ceramics community. The focus this month is piezoelectric and dielectric ceramics.

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Introduction to “Thermoelectrics” for ACT @ 20

By Jonathon Foreman / November 21, 2023

To celebrate the milestone of the 20th volume of the International Journal of Applied Ceramic Technology, the editorial team assembled a selection of journal papers representing the excellent work from the advanced ceramics community. The focus this month is thermoelectrics.

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Electronics in space—high-temperature electrical tests reveal potential of various packaging materials for silicon carbide sensors

By Lisa McDonald / November 21, 2023

Silicon carbide electronics are expected to play a role in future space missions to hot celestial bodies, such as Venus and the sun. A new study by researchers at NASA Glenn Research Center investigated the electrical properties of several ceramic and glass packaging materials to determine which would best protect silicon carbide electronics at temperatures of more than 800°C.

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